Santa Clara, Calif.: Santa Clara, Calif. The world’s largest chipmaker will have the next version of ASML’s most advanced lithography tool in 2024, an executive at a Taiwan Semiconductor Manufacturing Co. said at a conference Thursday.
During TSMC’s Technology Symposium in Silicon Valley, YJ Mii, Senior Vice President of Research and Development, said, “Looking forward, TSMC will bring high-NA EUV scanners in 2024 to provide customers with the necessary infrastructure and patterning solutions can be developed.” ,
Mi did not specify when the second-generation extreme ultraviolet lithography equipment, needed to make smaller and faster chips, would be used for mass production. TSMC rival Intel Corp has said it will use the machines in production by 2025 and has said it will be the first to receive the machines.
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As Intel enters the business of making chips designed by other companies, it will compete with TSMC for those customers. So the industry is watching closely to see which company has the edge in next-generation chip technology.
Kevin Zhanghe, TSMC’s senior vice president of business development, later clarified that TSMC will not be ready for production with the new high-NA EUV equipment in 2024, but will be used mostly for research purposes with partners.
“The importance of having TSMC in 2024 means they get to the most advanced technology faster,” said Dan Hutchson, chip economist at TechInsights, who was at the symposium. “EUV technology has become so important to be on the leading edge … High-NA is the next major innovation in EUV technology that will pioneer chip technology.”
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